BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically
conductive SIL PAD rubber. The material is designed for those applications in which maximum heat transfer is needed
and electrical isolation is not required.BERGQUIST Q PAD II is the ideal thermal interface material to replace
messy thermal grease compounds.
BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with grease such as contamination of reflow solder or cleaning
operations. Unlike grease, BERGQUIST QII can be used prior to these operations.
BERGQUIST Q PAD II also eliminates dust collection which can cause possible surface shorting or heat buildup.