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BERGQUIST SIL PAD TSP Q2500return


    BERGQUIST  SIL PAD  TSP Q2500

    Features and Benefits

    • Thermal impedance: 0.22°C-in.2/W

    (at 50 psi)

    • Maximum heat transfer

    • Aluminum foil-coated both sides

    • Designed to replace thermal grease


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BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically

conductive SIL PAD rubber. The material is designed for those applications in which maximum heat transfer is needed

and electrical isolation is not required.BERGQUIST Q PAD II is the ideal thermal interface material to replace

messy thermal grease compounds.

BERGQUIST SIL PAD  TSP Q2500 eliminates problems associated with grease such as contamination of reflow  solder or cleaning 

operations. Unlike  grease, BERGQUIST QII can be used prior to these operations.

BERGQUIST Q PAD II also eliminates dust collection which can cause possible surface shorting  or heat buildup.



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