BERGQUIST GAP PAD TGP A2600 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing
mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance.
BERGQUIST GAP PAD A3000 has a reinforcement layer on the dark gold side of the material that assists
in burn-in and rework processes while the light gold and soft side of the material allows for added compliance.
BERGQUIST GAP PAD A3000 Typical Applications Include:
1. Computers and peripherals
2. Heat pipe assemblies
3.CD-ROM and DVD cooling
4. Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader
5.Telecommunications • Memory modules
6. Between CPU and heat spreader
BERGQUIST GAP PAD TGP A2600 Configurations Available:
1.Sheet form, die-cut parts and roll form (converted or unconverted)