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    FEATURES AND BENEFITS

    ● Thermal Conductivity: 3.5 W/m-K

    ● Dispensable pre-cured gel

    ● Stable viscosity in storage and in the application

    ● Excellent chemical stability and mechanical stability


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BERGQUIST LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding

applications that require a balance between dispensability and low component stress during assembly and also in the

application.

BERGQUIST LIQUI-FORM 3500 is a one-part, highly conformable gel with thixotropic properties. The material is

precured and requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low

applied stress and reliable long-term performance.

BERGQUIST LF3500 is thixotropic and has a natural tack ensuring it forms around the component and

stays in place in the application.


TYPICAL APPLICATIONS

● Handheld devices

● Bare die to heat spreader lid

● Filling various gaps between heat-generating devices to

heat sink and housing

● Devices requiring low assembly pressure

● High value assemblies with rework

● BGA, PGA, PPGA


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