BERGQUIST LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding
applications that require a balance between dispensability and low component stress during assembly and also in the
BERGQUIST LIQUI-FORM 3500 is a one-part, highly conformable gel with thixotropic properties. The material is
precured and requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low
applied stress and reliable long-term performance.
BERGQUIST LF3500 is thixotropic and has a natural tack ensuring it forms around the component and
stays in place in the application.
● Handheld devices
● Bare die to heat spreader lid
● Filling various gaps between heat-generating devices to
heat sink and housing
● Devices requiring low assembly pressure
● High value assemblies with rework
● BGA, PGA, PPGA