The themal paste of BERGQUIST LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding

applications that require a balance between dispensability and low component stress during assembly and also in the

application.

BERGQUIST LIQUI-FORM 3500 is a one-part, highly conformable gel with thixotropic properties. The material is

precured and requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low

applied stress and reliable long-term performance.

BERGQUIST LF3500 is thixotropic and has a natural tack ensuring it forms around the component and

stays in place in the application.

Thermal paste of BERGQUIST LF3500 TYPICAL APPLICATIONS

● Handheld devices

● Bare die to heat spreader lid

● Filling various gaps between heat-generating devices to

heat sink and housing

● Devices requiring low assembly pressure

● High value assemblies with rework

● BGA, PGA, PPGA