Q: What is the primary difference between the BERGQUIST® BOND-PLY TBP 400B and BERGQUIST® BONDPLY TBP 850 products?
A: BERGQUIST® BOND -LY TBP 400B uses a dielectric film, replacing the fiberglass inherent in our BERGQUIST® BOND-PLY TBP 850 series products. The addition of the film
allows for high dielectric performance without additional product thickness.
Q: How should I size my interface dimensions for BOND-PLY?
A: BOND-PLY product testing has been completed on various interface materials. These tests have demonstrated that improper surface wet-out is the single largest variable associated with maximizing bond strength and heat transfer.
We have found that reducing the size of the interface pad to roughly 80% of the total interface area actually improves the overall bonding performance while offering significant improvements in total package cooling. Henkel offers three standard thicknesses for BERGQUIST® BOND-PLY TBP 850, allowing each application to be optimized in three dimensions.