Q: What is the primary difference between the

BERGQUIST® BOND-PLY TBP 400B and BERGQUIST® BONDPLY

TBP 850 products?

A: BERGQUIST® BOND -LY TBP 400B uses a dielectric film,

replacing the fiberglass inherent in our BERGQUIST®

BOND-PLY TBP 850 series products. The addition of the film

allows for high dielectric performance without additional

product thickness.

Q: How should I size my interface dimensions for BOND-PLY?

A: BOND-PLY product testing has been completed on various

interface materials. These tests have demonstrated that

improper surface wet-out is the single largest variable

associated with maximizing bond strength and heat transfer.

We have found that reducing the size of the interface pad

to roughly 80% of the total interface area actually improves

the overall bonding performance while offering significant

improvements in total package cooling. Henkel offers

three standard thicknesses for BERGQUIST® BOND-PLY TBP

850, allowing each application to be optimized in three

dimensions.