Q: What is the primary difference between the
BERGQUIST® BOND-PLY TBP 400B and BERGQUIST® BONDPLY
TBP 850 products?
A: BERGQUIST® BOND -LY TBP 400B uses a dielectric film,
replacing the fiberglass inherent in our BERGQUIST®
BOND-PLY TBP 850 series products. The addition of the film
allows for high dielectric performance without additional
Q: How should I size my interface dimensions for BOND-PLY?
A: BOND-PLY product testing has been completed on various
interface materials. These tests have demonstrated that
improper surface wet-out is the single largest variable
associated with maximizing bond strength and heat transfer.
We have found that reducing the size of the interface pad
to roughly 80% of the total interface area actually improves
the overall bonding performance while offering significant
improvements in total package cooling. Henkel offers
three standard thicknesses for BERGQUIST® BOND-PLY TBP
850, allowing each application to be optimized in three