BERGQUIST GAP PAD TGP A2600 is  a thermally conductive, filled-polymer  laminate, supplied on a reinforcing  

mesh for added electrical isolation,  easy material handling and enhanced  puncture, shear and tear resistance.  

BERGQUIST GAP PAD A3000 has a  reinforcement layer on the dark gold side  of the material that assists 

in burn-in and  rework processes while the light gold  and soft side of the material allows for  added compliance.

BERGQUIST GAP PAD A3000 Typical Applications Include: 

1. Computers and peripherals 

2. Heat pipe assemblies 

3.CD-ROM and DVD cooling 

4. Areas where heat needs to be  transferred to a frame, chassis or other  type of heat spreader 

5.Telecommunications • Memory modules 

6. Between CPU and heat spreader 

BERGQUIST GAP PAD TGP A2600 Configurations Available: 

1.Sheet form, die-cut parts and roll form (converted or unconverted)