BERGQUIST GP2500S20  is a thermally conductive, reinforced material rated at a thermal

conductivity of 2.4 W/m-K.The material is a filled-polymer material yielding extremely soft,

elastic characteristics.The material is reinforced to provide easy handling,converting,added

electrical isolation and tear resistance.BERGQUIST Gap Pad 2500S20 is well suited for low-pressure

applications that typically use fixed standoff or clip mounting.The material maintains a conformable,yet elastic

nature that allows for excellent interfacing and wet-out characteristics,even to surfaces with high roughness and/or topography.

GAP PAD TGP 2400 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during

application assembly.The material is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.

BERGQUIST GP2500S20 Typical Applications

• Between processors and heat sinks

• Between graphics chips and heat sinks

• DVD and CDROM electronics cooling

• Areas where heat needs to be transferred to a frame,chassis or other type of heat spreader

Configurations Available:

• Sheet form and die-cut parts