Laird Tflex HD90000 is available in thickness from 0.020” (500 µm) to 0.200” (5000 µm). Laird can
provide material to meet your production needs in any region through our local production
facilities. Please contact your local Laird sales or field engineering contact for samples or
questions.
Laird Tflex HD90000 is the latest product in our High Deflection series. Tflex HD90000
combines 7.5 W/mK thermal conductivity with superior pressure versus deflection
characteristics. The combination will allow minimal stress on components while also yielding
low thermal resistance. As a result, less mechanical and thermal stresses will be experienced
within your device.
Laird Thermal Gap Filler FEATURES AND BENEFITS
1. 7.5 W/mK thermal conductivity
2. Low pressure versus deflection
3. Excellent surface wetting for low contact resistance
4. Minimizes board and component stress
5. Low Outgassing
6. Low D3-D20 (< 20ppm)
7. Large tolerance applications
8. Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
AVAILABILITY
STANDARD THICKNESSES
1. 0.020” (500 µm) up to 0.200” (5000 µm) thick material available in 250 µm increments
2. Available in standard sheet sizes of 18” x 18” (1000 µm and up only) and 9” x 9” or custom die cut parts.
PART NUMBER SYSTEM
Tflex™ indicates Laird elastomeric thermal gap filler product line. HD90000 indicates Tflex™ HD90000 product line with thickness in microns
EXAMPLES:
1.Laird Tflex HD91000= 1000 µm (0.040”) thick Tflex™ HD90000 material
2.Laird Tflex HD95000= 5000 µm (0.200”) thick Tflex™ HD90000 material
