BERGQUIST GPVO,GAP PAD TGP 800VO  Formerly known as GAP PAD  VO

BERGQUIST GAP PAD  TGP 800VO is  a cost-effective, thermally conductive

interface material. The material is a filled, thermally conductive polymer supplied

on a rubber-coated fiberglass carrier allowing for easy material handling. The

conformable nature of BERGQUIST GAP  PAD  TGP 800VO allows the pad to fill

in air gaps between PC boards and heat  sinks or a metal chassis.