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BERGQUIST GAP PAD TGP 5000NT03返回


    • High thermal conductivity: 5.0 W/m-K

    • Highly conformable, “S-Class” softness

    • Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads

    • Natural inherent tack reduces interfacial thermal resistance


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BERGQUIST GAP PAD TGP 5000NT03, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforced, Gap Filling Material

BERGQUIST Gap Pad 5000S35 NT03(thermal pad) is a fiberglassreinforced filler and polymer featuring a high thermal conductivity. 

The material yields extremely soft characteristics while maintaining elasticity and conformability. 

The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. 

The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. 

The top side has reduced tack for ease of handling. BERGQUIST GP5000S35NT03(BERGQUIST thermal pad) is ideal for high-performance applications at low mounting pressures.

Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 

0.020", 0.040", 0.060", 0.080", 0.100", 0.125"Custom made configurations available upon request




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