EN

LIQUI-BOND

当前位置:首页>产品中心

BERGQUIST GAP FILLER 4000返回


    BERGQUIST  GF4000  Features and Benefits

    • Thermal conductivity: 4.0 W/m-K

    • Extended working time for

    manufacturing flexibility

    • Ultra-conforming with excellent

    wet-out

    • 100% solids – no cure by-products

    • Excellent low- and high-temperature

    chemical and mechanical stability


资料下载



BERGQUIST  GAP FILLER TGF 4000 is a  two-part, high performance, thermally conductive,

 liquid gap-filling material.The mixed material will cure at room  temperature and can be accelerated 

with the addition of heat. BERGQUIST GF4000 offers an extended working time to allow 

greater flexibility in the customer’s assembly process.


BERGQUIST  GAP FILLER 4000  Typical Applications:

• Automotive electronics

• Computers and peripherals

• Between any heat-generating semiconductor and a heat sink

• Telecommunications

Configurations Available:

• Supplied in cartridge or kit form


产品 一键拨号 一键导航