BERGQUIST GF4000 Features and Benefits
• Thermal conductivity: 4.0 W/m-K
• Extended working time for
manufacturing flexibility
• Ultra-conforming with excellent
wet-out
• 100% solids – no cure by-products
• Excellent low- and high-temperature
chemical and mechanical stability
Thermal paste of BERGQUIST GAP FILLER TGF 4000 is a two-part, high performance, thermally conductive,
liquid gap-filling material.The mixed material will cure at room temperature and can be accelerated
with the addition of heat. BERGQUIST GF4000 offers an extended working time to allow
greater flexibility in the customer’s assembly process.
Thermal paste of BERGQUIST GAP FILLER 4000 Typical Applications:
• Automotive electronics
• Computers and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
Configurations Available:
• Supplied in cartridge or kit form
