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    BERGQUIST  GAP PAD 1500S30  Features and Benefits

    • Thermal conductivity: 1.3 W/m-K

    • Highly conformable/low hardness

    • Decreased strain on fragile components

    • Fiberglass-reinforced for puncture,

    shear and tear resistance

    • Quick rebound to original shape


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BERGQUIST GAP PAD TGP 1300 is a  highly compliant GAP PAD material that is ideal for fragile

 component leads.The material is fiberglass-reinforced  for improved puncture resistance and

handling characteristics. BERGQUIST GAP PAD 1500S30 maintains a  conformable, 

yet elastic nature that  provides excellent interfacing and wet-out  characteristics, even to surfaces 

with high  roughness or uneven topography.BERGQUIST GP1500S30  features an inherent 

tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.


BERGQUIST  GAP PAD 1500S30  Typical Applications:

• Between any heat-generating component and a heat sink

• Computers and peripherals

• Telecommunications

• Between any heat-generating semiconductor and a heat sink

• Shielding devices

Configurations Available:

• Sheet form and die-cut parts


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