BERGQUIST GAP PAD TGP 1300(thermal pad) is a highly compliant GAP PAD material that is ideal for fragile
component leads.The material is fiberglass-reinforced for improved puncture resistance and
handling characteristics. BERGQUIST GAP PAD 1500S30 maintains a conformable,
yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces
with high roughness or uneven topography.BERGQUIST GP1500S30(BERGQUIST thermal pad) features an inherent
tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.
BERGQUIST GAP PAD 1500S30 Typical Applications:
• Between any heat-generating component and a heat sink
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
• Shielding devices
Configurations Available:
• Sheet form and die-cut parts