BERGQUIST GP1500  Features and Benefits

• Thermal conductivity: 1.5 W/m-K

• Unreinforced construction for

additional compliancy

• Conformable, low hardness

• Electrically isolating

BERGQUIST GAP PAD TGP 1500 has an ideal filler blend that gives it a lowmodulus characteristic, 

which maintains optimal thermal performance yet still allows for easy handling. The natural

tack on both sides of the material allows for good compliance to adjacent surfaces of components, 

minimizing interfacial resistance.

BERGQUIST GAP PAD 1500  Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Memory modules / chip scale packages

• Areas where heat needs to be transferred to a frame chassis or other type

of heat spreader

Configurations Available:

• Sheet form and die-cut parts