BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a

thermal conductivity of 7.0 W/m-K. It is specially formulated for highperformance

applications requiring low assembly stress. The material offers exceptional thermal performance 

at low pressures due to the unique filler package and ultra-low modulus resin  formulation.

BERGQUIST GAP PAD  7000ULM is highly conformal to rough or irregular surfaces, 

allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing 

for ease of use.

BERGQUIST GAP PAD  7000ULM  Typical Applications Include:

• Telecommunications (routers, switches and base stations)

• Optical transceivers

• ASICs and DSPs

Configurations Available:

• Sheet form: 8” x 8”

• Standard thickness: 0.040, 0.060, 0.080, 0.100, 0.125 in.

• (1, 1.5, 2.0, 2.5, 3.18 mm)