reliability testing required for long product life applications. It has stable thermal impedance across accelerated aging
tests and does not display bleeding, pumping, or flow out.
PTM7900-SP has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
PHYSICAL PROPERTIES
1.Color:Light Blue
2.Specific Gravity:2.8
3.Thickness (mm):0.2 / 0.25 / 0.3 / 0.4 / 0.5
THERMAL PROPERTIES
1.Thermal Conductivity: 8W
2.Thermal Impedance: 0.04-0.08