Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal  performance and high compliancy. 

The soft interface pad conforms to component  topography, resulting in little or no stress on the components and mating chassis or parts. 

Unique silicone and ceramic filler technology allows a combination of high compliancy and  high thermal performance.

Laird Tflex 700 is stable from -40°C thru 200°C and meets UL 94V0  flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits  thermal performance.

Tflex 780 FEATURES AND BENEFITS

1.Thermal conductivity 5.0 W/mK 

2.Highly compliant

3. Low thermal resistance even at low pressure

4. Available in thicknesses from 0.5mm thru 5.0mm (0.020” thru 0.200”) in 0.25mm (0.010”) increments 

5.Naturally tacky for adhesion during assembly and transport