Parker Chomerics THERM-A-GAP Gel 30 is a fully cured dispensable gel designed  to eliminate time consuming hand  assembly, 

decreasing installation costs  and reducing customer manufacturing  and purchasing (logistical) complexity.

 It  requires no mixing or curing, providing  superior design flexibility.  

Chomerics Gel 30 Product Attributes: 

1. Provides low thermal impedance at  thin and thick gaps, allowing use of  common heat spreaders 

2. Proven reliability in extreme  temperature cycling and shock &  vibration 

3. Deflects easily under very low  compressive forces, decreasing  stress on components thus  decreasing component failures. 

4. Accommodates a variety of bond  line thicknesses for application to  multiple devices

5.Successfully used to fill a variety of  different gap thickness 

6. Compatible with high volume,  automated dispense processes 

7. Meets Telcordia (Bellcore) silicone  specifications

Parker GEL30 Typical Applications

1.Automotive electronic control units  (ECUs)

2.Power supplies & semiconductors 

3.Memory and power modules
4.Microprocessors and graphics  processors 

5.Flat panel displays & consumer