BERGQUIST GAP PAD is a low-modulus polymer material that conforms to surfaces and fills microscopic surface gaps. 

GAP PAD often serves as an interface between heat sinks and electronic devices. 

This polymer material prevents damage from uneven topographies, air gaps and rough surface textures.

Bergquist’s GAP PAD thermal management products play an important role in a variety of electronics manufacturing applications.

GAP PAD Features

Each electronic device has different requirements, and Bergquist manufactures a range of products to suit these diverse needs. 

GAP PAD offers the following features: 

Conformability: Can conform to rough, uneven surfaces, providing low-stress compression.

Corrosion control: Electrically isolating properties to prevent interface corrosion.

Natural tack: Helps the Gap Pad® remain in place during assembly.

Adhesive backing: Available with or without an adhesive backing.

Fiberglass reinforcement: Optional rubber-coated fiberglass reinforcement.

Rubber reinforcement: Rubber reinforcement option as an alternative to fiberglass.

Various thicknesses: Choose from available thicknesses between 0.010 inches and 0.250 inches.

Silicon-free option: Select a silicon-free Gap Pad® available in thicknesses between 0.010 inches and 0.125 inches.

Thermal conductivity: Transfers heat from electronic components to a device's heat sink effectively.

The commonly used BERGQUIST GAP PAD materials are GAP PAD TGP 1000VOUS,GAP PAD VO ULTRA SOFT,GAP PAD TGP 5000,GAP PAD TGP 3000,

GAP PAD TGP HC5000,GAP PAD TGP HC3000

The high thermal conductivity pads are GAP PAD TGP 12000ULM,GAP PAD TGP 7000ULM,GAP PAD TGP 12000

Silicone free thermal pad are BERGQUIST GAP PAD TGP 1100SF,BERGQUIST GAP PAD TGP 3004SF