Laird  Tflex HD7.5 gap filler is a new developed very soft silicone material in our high deflection  series. 

With a thermal conductivity of 7.5W/ mk, Tflex HD7.5 is designed to provide superior  pressure versus deflection characteristics. 

The material will provide minimal stress on components  during application while maintaining low thermal resistance. 

As a result, less mechanical and thermal  stresses will be experienced within your device. 

LAIRD Tflex HD7.5 gap filler is available in thickness from 1mm (0.040”) to 5mm (0.200”).