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Thermal pad

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LAIRD Tflex SF10 Thermal Gap Filler返回


    FEATURES AND BENEFITS  

    1. Silicone free formulation 

    2.Low peak and residual pressure  

    3.Excellent surface wetting for low contact resistance  

    4.Exceptionally low thermal resistance  

    5.No Fiberglass reinforcement  

    6.Environmentally friendly solution that meets regulatory requirements  including RoHS and REACH

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LAIRD Tflex SF10 is an innovative, high performing thermal material in Laird’s gap filler  portfolio. 

This silicone free material measures 10W high thermal conductivity and has excellent  deflection properties which provides minimal pressure on components during  deflection. 

Very little pressure is required to reach the lowest possible thermal  resistance.




AVAILABILITY  

0.5 mm (0.020”) to 4.0 mm (0.160”) thick material available in 0.25mm (0.010”) increments  

Available in standard sheet sizes of 9” x 9” or custom converted die cut parts  

DF material available to remove tack from one side  

A1 material to add adhesive to one side  


PART NUMBER SYSTEM  

Tflex indicates Laird elastomeric thermal gap filler product line. SF10 is a silicone free 10 W/mk material. Thickness of the sheet in  mm is listed after the material name.  

EXAMPLES:  Tflex SF10,1.00 = 1.00mm thick Tflex SF10 material  Tflex  SF10DF,1.00 = 1.00mm thick Tflex SF10 material with only one side tacky

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