LOCTITE 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. 

This material is formulated to give excellent dot size and shape control when applied with a stencil using hand print or machine print process. 

LOCTITE 3626M is halogen free and offers a very high thermal mechanical strength even at temperatures as high as 260ºC.

TYPICAL PROPERTIES OF UNCURED MATERIAL 

Specific Gravity @ 25 °C                    1.4 

Density, g/cm³                                     1.3

Flash Point - See SDS 

Yield Point, 25 °C, Pa                               190-250^LMS

 Cone & Plate Rheometer: 

 Haake PK 100, M10/PK 1 2° Cone 

Casson model @ 0.4 - 30 s -1

TYPICAL PROPERTIES OF CURED MATERIAL 

Cured for 30 minutes @ 150 °C 

Physical Properties 

Coefficient of Thermal Expansion, 

ASTM D696, K -1: 

Below Tg, µm/mºC                                                      48 

Above Tg, µm/mºC                                                    184 

Glass Transition Temperature (Tg), °C                     138

Cure Speed vs. Time, Temperature 

The following graph shows the rate of conversion with time under certain temperature.

Hot Strength Tested at temperature