PRODUCT DESCRIPTION

A 7 W/m-K, extremely soft Gap Pad with exceptional thermal performance at low pressures.

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a high thermal conductivity of 7.0 W/m-K. 

It is specially formulated for high performance applications requiring low assembly stress. 

The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.

BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. 

Protective liners are supplied on both sides allowing for ease of use.

TYPICAL APPLICATIONS

● Telecommunications (routers, switches, base stations) 

● Optical transceivers 

● ASICs and DSPs 

TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties 

Hardness, Shore 000, ASTM D2240                               75 

Inherent Surface Tack                                                      2 

Density, ASTM D792, g/cc                                               3.2 

Heat Capacity, ASTM E1269, J/g-K                                 1.1 

Shelf life, days                                                                  180 

Young's Modulus                                                            kPa 152 

                                                                                       (psi) (22)

Electrical Properties 

Dielectric Constant, ASTM D150, 1,000Hz                       8.7

Dielectric Breakdown Voltage : 

40 mil sample, VAC                                                         >5,000

Volume Resistivity, ASTM D257, ohm-meter                  1.2×10¹¹  

Thermal Properties 

Thermal Conductivity, ASTM D5470, W/(m-K)                   7.0