BERGQUIST GAP PAD TGP 12000 is a soft gap filling material rated at a thermal conductivity of 12 W/m-K.
It is specially formulated for high performance applications requiring low assembly stress.
The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation .
The material offers exceptional thermal performance at low pressures. BERGQUIST GAP PAD TGP 12000 is highly conformal to rough or irregular surfaces,
allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
TYPICAL PROPERTIES OF CURED MATERIAL
Color Red
Physical Properties
Hardness, Shore 000, ASTM D2240 76
Inherent Surface Tack 2
Density, ASTM D792, g/cc 3.1
Heat Capacity, ASTM E1269, J/g-K 0.7
Shelf life, days 365
Young's Modulus kPa 593
(psi) (86)
Electrical Properties
Volume Resistivity, ASTM D257, ohm-meter 10×1010
Dielectric Constant, ASTM D150, 1,000Hz 7.0
Dielectric Breakdown Voltage: 40 mil sample, VAC 17,700
Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 12
Typical Applications
1.Telecommunications (routers, switches, base stations)
2.Optical transceivers
3. ASICs and DSPs
Material solutions for cloud recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for cloud datacenter recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for hyperscale datacenter recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for switches recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for routers recommends BERGQUIST GAP PAD TGP 12000ULM
Material solutions for servers recommends BERGQUIST GAP PAD TGP 12000ULM
