Honeywell PCM45F, a highly thermally conductive Phase Change  Material (PCM), was designed to minimize thermal resistance at  interfaces. 

Based on a novel polymer PCM system, Honeywell PCM45F-SP this material exhibits  excellent wetting at interfaces during typical operating temperature  range, 

resulting in very low surface contact resistance. It is available  in both pad and paste/printable formats. 

A proprietary filler material provides high thermal conductivity (2.0–5.0  W/m˚C) and a low thermal impedance (<0.20˚C cm2/W), 

suitable for  high performance IC devices.

THERMAL IMPEDANCE POST RELIABILITY

(No shim @ 40psi)         Honeywell PCM45F                Honeywell  PCM45F-SP 

End of Line                         0.12˚C-cm2/W                           0.12˚C-cm2/W 

1000 hrs T/C “B”             0.08˚C-cm2/W                            0.08˚C-cm2/W 

Baking 500 hrs                   0.08˚C-cm2/W                           0.08˚C-cm2/W @ 150˚C