5.0 W/mK thermal conductivity
Low pressure versus deflection
Excellent surface wetting for low contact resistance
Minimizes board and component stress
Option for additional electrical isolation and tear resistance
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
LAIRD Tflex HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics.
The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and
thermal stresses will be experienced within your device. Tflex HD720 PI can be provided with an integrated polyimide film on one side.
This liner provides numerous application benefits like electrical isolation, placement ease during assembly, and tear resistance for applications
that require shear. Tflex HD720 and Tflex HD700PI are available in thickness from 0.5mm (0.020”) to 5mm (0.200”).
The standard material LAIRD Tflex HD700 material is a light pink color, but we do have the option to provide this in a grey color if a neutral color is desired (Tflex HD700,GR).