BERGQUIST Q Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder
baths. SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the
elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks.
Fiberglass reinforcement enables BERGQUIST Q3 to withstand processing stresses without losing physical integrity. It also provides
ease of handling during application.