hothree HTGP 200 ( Thermal Pad Fiberglass )has an ideal filler blend that gives it a low-modulus characteristic 

that maintainsoptimal thermal performance yet still allows for easyhandling. 

The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, 

minimizing interfacial resistance.

hothree HTGP 200 (Thermal Conductive Silicone Pad) can be die-cut into various shapes,easy to operate. 

The thermal conductivity can reach 2.0w/m-k and the standard hardness is 20~60 shore00.

Thickness is 0.5~6mm and the standard specification is W200mm*L400mm/sheet.

Produced by our own formula, we can customize the color, hardness and thickness according to the requirements.

hothree HTGP 200 (Ultra Soft Thermal Pad)  Applications

• Telecommunications

• Consumer electronics

• Thermal modules

hothree HTGP 200 (Thermal silicone pad) can replace BERGQUIST GP2000S40,BERGQUIST Gap Pad 2000S40

BERGQUIST GP2500S20,BERGQUIST Gap Pad 2500S20

LAIRD Tflex 600,LAIRD Tflex 300,LAIRD T-gard K52

FUJIPOLY SARCON PG80B,SARCON PG80A,FUJIPOLY GR-HM