hothree HTGP 500 (Thermal pad fiberglass) is a fiberglass based filled mixture with high thermal conductivity.
The material yields extremely soft characteristics while maintaining elasticity.
hothree HTGP 500 (Ultra soft thermal pad) the fiberglass reinforcement added electrical isolation and tear resistance.
The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance.
hothree HTGP 500(Thermal Gap Filler pad) can be die-cut into various shapes,easy to operate.
The thermal conductivity can reach 5.0w/m-k and the standard hardness is 35 shore00.
Thickness is 0.5~8mm and the standard specification is W200mm*L400mm/sheet.
Produced by our own formula, we can customize the color, hardness and thickness according to the requirements.
hothree HTGP 500(Thermal Silicone Pad) Applications
• Consumer electronics
• Thermal modules
hothree HTGP 500(Thermal conductive silicone pad) can replace BERGQUIST GP5000S35,BERGQUIST GAP PAD 5000S35,
BERGQUIST GAP PAD TGP 5000,BERGQUIST GPHC5.0,BERGQUIST GAP PAD HC5.0,BERGQUIST GAP PAD TGP HC5000,
LAIRD TFLEX HD300,LAIRD TFLEX300,LAIRD TFLEX HD9000
FUJIPOLY SARCON PG80B,SARCON PG80A,FUJIPOLY GR-HM