BERGQUIST Hi-Flow 625 is a film-reinforced phase change material.
The product consists of a thermally conductive 65°C phase change compound coated on PEN film.
BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.
The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems.
The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature and
does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.
BERGQUIST HF625 Typical Applications Include:
1.Spring / clip mounted
2. Power semiconductors
HI FLOW THF 500 Configurations Available:
1.Sheet form, die-cut parts and roll form
2. With or without pressure sensitive adhesive