When it comes to cooling equipment, it is impossible not to talk about thermally conductive silicone pad. Thermal silicone sheet is one of the most widely sold traditional process thermal interface materials,
with a wide range of applications. Although Thermal silicone sheet is used as a cooling auxiliary material for equipment, its role is very powerful.
Thermal pad is a kind of gap filling gasket made of silicone oil as the base material, adding thermal conductivity, insulation and temperature resistant materials.
Thermal silicone sheet has the characteristics of high thermal conductivity, low interface thermal resistance, insulation, compressibility and so on.
Because the texture of thermal conductive silica gel sheet is soft, it can realize small thermal resistance under low pressure. At the same time, the air between the contact surface is excluded and the rough
surface between the contact surface is fully filled to improve the heat conduction effect of the contact surface. Because of the good filling effect of the Thermal silicone sheet, it can effectively conduct
the heat of the heating source to the shell, and the Thermal silicone sheet has good compressibility and elasticity, which can well serve as a shock absorber pad.
We make available for our clients a top-of-the-line range of Thermal Pad which is mainly used in electronic devices and heat sinks or product transfer interface between the enclosures.
The combination of a tough carrier material such as fiberglass and thermally conductive silicone pad which is conformable provides the engineer with a more versatile material than mica
or ceramics and grease. Our product is known to be a special type of chemical that greatly improves heat transfer as well as the cooling of the processor.
The combination of a tough carrier material such as fiberglass and thermally conductive silicone pad which is conformable provides the engineer with a more versatile material than
mica or ceramics and grease. Thermal Pad based on silica gel as a substrate, adding metal oxides and other auxiliary materials, a thermal conductivity of dielectric materials synthesized
through a special process. The pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage.
It is designed to take advantage of the design of the gap transfer heat production, able to fill the gap to complete the heat transfer between the heating part and cooling parts,
and also played the role of insulation, cushioning, sealing, etc. It is able to meet the requirements of equipment miniaturization and ultra-thin design, is an excellent thermal conductivity
filler material whit highly technology use, and for a wide range of thickness. Our products also have high thermal stability that results in making them perform under severe conditions.