See how Henkel Bergquist 12W ultra-high thermal conductivity, low modulus gaskets are keeping up with the fast track of 5G.
Higher power densities will become the norm as 5G connectivity requires more powerful and smaller telecoms infrastructure components.
High-end routers, servers, switches and baseband units will integrate more functionality into an already small footprint. To ensure system
reliability and optimal performance, high thermal conductivity solutions must be used for heat dissipation.
Thermal conductive gaskets GPA PAD are pre-cured thermally conductive materials that are soft and flexible; they are typically used to
fill large interface gaps and support relatively large area coverage; they can be used between semiconductor chips and heat sinks, between
heat sink components and housings, between power supply power devices such as PMICs, IGBT/MOSFET components and housings to absorb
assembly tolerances and efficiently transfer heat
Thermally conductive gaskets are divided into silicone and non-silicone substrates, and depending on the application, glass fibres or PI films are
also added to enhance electrical insulation and structural strength for ease of handling. Thermally conductive gaskets are better able to fill uneven
and rough interfaces than thermally conductive gels/liquid gap fillers, are suitable for non-automated assembly scenarios and have relatively
high insulation properties.