Today's consumers want smaller devices, more functionality, outstanding reliability and, of course, lower costs.
In semiconductor packaging, this can all be achieved with Henkel's material solutions. As a total solutions provider,
Henkel not only uses its extensive global coverage and manufacturing network to deliver superior technology,
but also ensures regional support for its customers through customized solutions.
With our long-standing expertise, we offer a wide range of technical tool sets and application knowledge,
including resin and filler technology.
Henkel focuses on fostering technological leadership through strong innovation, offering applications that not only respond to,
but also drive the future of electronics. From chip bonding agents to liquid and film sealants,
EMI shielding conductive coatings, primary bottom fillers such as liquids and films, thermally conductive materials as well as
conductive and non-conductive adhesives for sensors and modules, we are not only able to meet our customers' needs
but are also able to offer the most advanced and reliable technology on the market.
The hot selling products are:GAP FILLER TGF 3600（BERGQUIST GF3500S35)、HI-FLOW THF 1600P （BERGQUIST HF300P)
GAP PAD TGP 1000VOUS (BERGQUIST GPVOUS)、GAP PAD TGP HC3000 （BERGQUIST GPHC3.0)、SIL PAD TSP 1600 (BERGQUIST SP900S)、
SIL PAD TSP 1800 （BERGQUIST SP1200)、 SIL PAD TSP 3500 （BERGQUIST SP2000)、SIL PAD TSP Q2500 （BERGQUIST Q PAD II)、
SIL PAD TSP Q2000 （BERGQUIST Q PAD 3) 、SIL PAD TSP 1680（SIL PAD 980）、SIL PAD TSP K900（SIL PAD K-4）、SIL PAD TSP K1100（SIL PAD K-6）