Features and Benefits

    • Thermal Impedance:0.53 o C-in 2 /W

    (@ 50 psi)

    • Exceptional thermal performance at lower

    application pressures

    • Smooth and non-tacky on both sides for

    easy re-positioning,ease of use and assem-

    bly error reduction

    • Superior breakdown voltage and surface

    “wet out”values

    • Designed for applications where electrical

    isolation is critical

    • Excellent cut-through resistance,designed

    for screw and clip mounted applications


BERGQUIST SP1200 is a silicone based,fiberglass-reinforced thermal interface material featuring

a smooth,highly compliant surface.The mate-rial features a non-tacky surface for efficient

re-positioning and ease of use,as well as an optional adhesive coating.SIL PAD TSP 1800

exhibits exceptional thermal performance at low and high application pressures.The mate-

rial is ideal for placement between electronic power devices and a heatsink for screw and

clip mounted applications.

BERGQUIST Sil-Pad 1200 Typical Applications Include:

• Automotive electronics control modules • Power supplies

• Motor controls • Audio amplifiers

• Discrete devices • Telecommunications

Configurations Available:

• Sheet form,slit-to-width roll form

• Die-cut parts

• 9,12 and 16 mil thicknesses

• Adhesive coating

We produce thousands of specials and customs.

Tooling charges vary depending on tolerances and complexity of the part.

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