Features and Benefits
• Thermal Impedance:0.53 o C-in 2 /W
(@ 50 psi)
• Exceptional thermal performance at lower
application pressures
• Smooth and non-tacky on both sides for
easy re-positioning,ease of use and assem-
bly error reduction
• Superior breakdown voltage and surface
“wet out”values
• Designed for applications where electrical
isolation is critical
• Excellent cut-through resistance,designed
for screw and clip mounted applications
BERGQUIST SP1200 is a silicone based,fiberglass-reinforced thermal interface material featuring
a smooth,highly compliant surface.The mate-rial features a non-tacky surface for efficient
re-positioning and ease of use,as well as an optional adhesive coating.SIL PAD TSP 1800
exhibits exceptional thermal performance at low and high application pressures.The mate-
rial is ideal for placement between electronic power devices and a heatsink for screw and
clip mounted applications.
BERGQUIST SIL PAD 1200 Typical Applications Include:
• Automotive electronics control modules • Power supplies
• Motor controls • Audio amplifiers
• Discrete devices • Telecommunications
Configurations Available:
• Sheet form,slit-to-width roll form
• Die-cut parts
• 9,12 and 16 mil thicknesses
• Adhesive coating
We produce thousands of specials and customs.
Tooling charges vary depending on tolerances and complexity of the part.
