EN

Gap-Pad

当前位置:首页>产品中心

BERGQUIST Q PAD II返回


      BERGQUIST  SIL PAD  TSP Q2500

      Features and Benefits

      • Thermal impedance: 0.22°C-in.2/W

      (at 50 psi)

      • Maximum heat transfer

      • Aluminum foil-coated both sides

      • Designed to replace thermal grease




资料下载



BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically

conductive SIL PAD rubber. The material is designed for those applications in which maximum heat transfer is needed

and electrical isolation is not required.BERGQUIST Q PAD II is the ideal thermal interface material to replace

messy thermal grease compounds.

BERGQUIST SIL PAD  TSP Q2500 eliminates problems associated with grease such as contamination of reflow  solder or cleaning 

operations. Unlike  grease, BERGQUIST QII can be used prior to these operations.

BERGQUIST Q PAD II also eliminates dust collection which can cause possible surface shorting  or heat buildup.



产品 一键拨号 一键导航