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Sil-Pad

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BERGQUIST SIL-PAD 1000L返回


    FEATURES AND BENEFITS

    ● Thermal impedance: 1.13ºC-in 2 /W @ 50 psi

    ● Original Sil-Pad material

    ● Excellent mechanical and physical characteristics

    ● Flame retardant


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BERGQUIST SIL PAD TSP 1700L material is designed for

applications where low mounting pressure is used and low

thermal resistance is required. BERGQUIST SIL-PAD 1000L

achieves this with the combination of a smooth surface

design and high thermal conductivity (dielectric) silicone rubber

.

Applications requiring low component clamping forces include

discrete semiconductors (TO-220, TO-247 and TO-218)

mounted with spring clips. Spring clips provide quick assembly

but apply a limited amount of pressure to the semiconductor.

The smooth surface texture of BERGQUIST SP1000L

minimizes interfacial thermal resistance and maximizes

thermal performance.


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