BERGQUIST Gap Pad 3000S30返回

    features and Benefits
    • Thermal conductivity: 3.0 W/m-K
    • Low “S-Class” thermal resistance at very
    low pressures
    • Highly conformable,“S-Class” softness
    • Designed for low-stress applications
    • Fiberglass reinforced for puncture, shear
    and tear resistance


Bergquist GP3000S30 is a soft gap filling material
rated at a thermal conductivity of 3 W/m-K.
The material offers exceptional thermal
performance at low pressures due to an allnew
3 W/m-K filler package and low-modulus
resin formulation. It is reinforced to enhance
material handling, puncture, shear and tear
resistance. It is well suited for high performance,
low-stress applications that typically use
fixed standoff or clip mounting. Gap Pad
3000S30 maintains a conformable yet elastic
nature that allows for excellent interfacing
and wet-out characteristics, even to surfaces
with high roughness and/or topography.
Gap Pad TGP 3000 (thermal pad) is offered with natural
inherent tack on both sides of the material,
eliminating the need for thermally-impeding
adhesive layers.The material’s natural inherent
tack allows for stick-in-place characteristics
during assembly. Gap Pad 3000S30(BERGQUIST thermal pad)is supplied
with protective liners on both sides.The top
side has reduced tack for ease of handling.

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