BERGQUIST GP3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K.
The material offers exceptional thermal performance at low pressures due to an allnew
3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance
material handling, puncture, shear and tear resistance. It is well suited for high performance,
low-stress applications that typically use fixed standoff or clip mounting. Gap Pad 3000S30 maintains a conformable yet elastic
nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
BERGQUIST GAP PAD TGP 3000 (thermal pad) is offered with natural inherent tack on both sides of the material,
eliminating the need for thermally-impeding adhesive layers.The material’s natural inherent tack allows for stick-in-place characteristics
during assembly. BERGQUIST GAP PAD 3000S30(BERGQUIST thermal pad)is supplied with protective liners on both sides.The top
side has reduced tack for ease of handling.