FEATURES AND BENEFITS
● Thermal Conductivity: 3.0 W/m-K
● Low “S-Class” thermal resistance at very low pressures
● Highly conformable, “S-Class” softness
● Designed for low-stress applications
● Fiberglass reinforced for puncture, shear and tear
HSR-3000 Thermal Conductive Insulating Silicone Gasket is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers
exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation.
It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance,
low-stress applications that typically use fixed standoff or clip mounting. HSR-3000 Thermal Conductive Silicone Gasket maintains a
conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with
high roughness and/or topography.HSR-3000 Thermal Silicone Pad is offered with natural inherent tack on both sides of the
material, eliminating the need for thermally-impeding adhesive layers. The material’s natural inherent tack allows for stick-in-place
characteristics during assembly. HSR-3000 Thermal Silicone Pad is supplied with protective liners on both sides. The top side has
reduced tack for ease of handling.