HSR-1500  Non-Silicon Thermal Pad  has an ideal filler blend that gives it a low-modulus characteristic, 

which maintains optimal thermal performance yet still allows for easy handling. The natural tack on both 

sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.

HSR-1500 Thermal Silicone Pad Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Memory modules / chip scale packages

• Areas where heat needs to be transferred to a frame chassis or other type

of heat spreader

HSR-1500 Thermal Conductive Silicone Gasket  Configurations Available:

• Sheet form and die-cut parts

It can replace Bergquist GP1500,Bergquist GAP PAD 1500,Laird Tflex300