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BERGQUIST LIQUI-BOND EA 1805 return


    BERGQUIST LIQUI-BOND TLB EA1800 (Two-Part)

    Features and Benefits

    • Room temperature cure

    • Room temperature storage

    • Thermal Conductivity: 1.8 W/m-K

    • Eliminates need for

    mechanical fasteners

    • Maintains structural bond in

    severe environment applications

    • Excellent chemical and

    mechanical stability


Data download



BERGQUIST  LIQUI-BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. 

BERGQUIST LIQUI-BOND EA 1805 has a thermal conductivity of 1.8 W/mK.BERGQUIST  LIQUI-BOND 

TLB EA1800 will be supplied in a two-component format,and refrigeration is not required.BERGQUIST 

LIQUI-BOND EA 1805 has a high bond strength with room  temperature cure that can be accelerated 

with additional heat. The high bond strength eliminates the need  for fasteners and maintains structural 

bond in severe environments. Recommended usage is filling any surface irregularities between heat sources 

and heat spreaders of similar CTE. BERGQUIST  LIQUI-BOND TLB EA1800 is thixotropic and will remain in

place during dispensing, and the material will flow easily under minimal pressure, resulting in thin bond lines and 

very low stress placed on fragile components  during assembly.


Typical Applications:

• LED lighting

• Power supplies

• Discrete component to heat spreader

• Automotive lighting

• White goods

Configurations Available:

• Supplied in cartridge or kit form


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