Thermal paste of BERGQUIST  GAP FILLER TGF 1500LVO is a two-part, high performance, thermally  conductive, 

liquid gap-filling material.This material offers the high temperature resistance and low modulus of 

a silicone material with significantly lower levels of silicone outgassing for use in silicone-sensitive 

applications.The mixed material will cure at room temperature and can be accelerated with the addition 

of heat. As cured,BERGQUIST  GAP FILLER 1500LV  provides a soft, thermally conductive, form-in-place 

elastomer that is ideal for fragile assemblies or for filling unique and intricate air voids and gaps. Liquid dispensed 

thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. 

Thermal paste of BERGQUIST  GF1500LV exhibits low level natural tack characteristics and is intended for use in 

applications where a strong structural bond is not required.