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BERGQUIST GAP FILLER 3500S35return


    BERGQUIST GF3500S35  Features and Benefits

    • Thermal conductivity: 3.6 W/m-K

    • Thixotropic nature makes it easy

    to dispense

    • Two-part formulation for easy storage

    • Ultra-conforming – designed for fragile

    and low stress applications

    • Ambient or accelerated cure schedules


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BERGQUIST GF3500S35,GAP FILLER 3500S35,GAP FILLER TGF 3600  

BERGQUIST GAP FILLER TGF 3600 is a two-component, liquid gap-filling material, 

cured at either room or elevated temperature, featuring ultra-high thermal

performance and outstanding softness.Prior to curing, the material maintains

good thixotropic characteristics as well as low viscosity. The result is a gel-like

liquid material designed to fill air gaps and voids yet flow when acted upon by

an external force (e.g., dispensing or assembly process). The material is an

excellent solution for interfacing fragile components with high topography and/

or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a

low modulus elastomer designed to assist in relieving CTE stresses during thermal

cycling yet maintain enough modulus to prevent pump-out from the interface.

BERGQUIST GAP FILLER TGF 3600 will lightly adhere to surfaces, thus improving

surface area contact. BERGQUIST  GAP FILLER 3500S35 is not designed to be a

structural adhesive.


BERGQUIST GF3500S35   Typical Applications Include:

• Automotive electronics

• Discrete components to housing

• PCBA to housing

• Fiber optic telecommunications equipment

Configurations Available:

• Supplied in cartridge or kit form


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