BERGQUIST SP800 Features and Benefits
• Thermal impedance: 0.45°C-in.2/W
(at 50 psi)
• High-value material
• Smooth and highly compliant surface
• Electrically isolating
BERGQUIST SP800 SIL PAD 800 SIL PAD TSP 1600
The BERGQUIST SIL PAD TSP 1600 (SP800) family of thermally conductive insulation materials is designed for applications
requiring high thermal performance and electrical isolation. These applications also typically have low mounting
pressures for component clamping.BERGQUIST SIL PAD TSP 1600(SP800) material combines a smooth and highly compliant
surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
