BERGQUIST SP900S Features and Benefits:
• Thermal impedance: :0.61°C-in2/W(@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution
BERGQUIST SP900S, SIL PAD 900S, SIL PAD TSP 1600S
The true workhorse of the SIL PAD product family, SIL PAD900S (SP900S)thermally conductive insulation material
is designed for a wide variety of applications requiring high thermal performance and electrical isolation.
These applications also typically have low mounting pressures for componentclamping.
SIL PAD 900S (SIL PAD TSP 1600S)material combines a smooth and highly compliant surface characteristic with
high thermalconductivity. These features optimize the thermal resistance properties at low pressures.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247
and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount
of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal
resistance and maximizes thermal performance.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive