BERGQUIST  GAP PAD TGP 800VOS   GAP PAD VO Soft

BERGQUIST GAP PAD TGP 800VOS  is recommended for applications that  require a minimum amount of pressure

on components. BERGQUIST GAP PAD  VO Soft is a highly conformable,low-modulus, filled-silicone polymer on

a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a

leaded device.

BERGQUIST  GPVOS  Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Between heat-generating semiconductors or magnetic components and a heat sink

• Areas where heat needs to be transferred to a frame, chassis, or other type of

heat spreader

Configurations Available:

• Sheet form and die-cut parts