GP5000S35-0.040-02-0816 BERGQUIST GP5000S35 Features and Benefits
• High-thermal conductivity: 5.0 W/m-K
• Highly conformable, “S-Class” softness
• Naturally-inherent tack reduces
interfacial thermal resistance
• Conforms to demanding contours and
maintains structural integrity with little
or no stress applied to fragile
component leads
• Fiberglass reinforced for puncture,
shear and tear resistance
• Excellent thermal performance at
low pressures
GP5000S35-0.040-02-0816 BERGQUIST GAP PAD TGP 5000(thermal pad) is a fiberglass-reinforced filler and polymer featuring
a high thermal conductivity. The material yields extremely soft characteristics while maintaining
elasticity and conformability. The fiberglass reinforcement provides easy handling and converting,
added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application
and allows the product to effectively fill air gaps,enhancing the overall thermal performance.The top side has
reduced tack for ease of handling. GP5000S35-0.040-02-0816 BERGQUIST GP5000S35 is ideal for high-performance
applications at low mounting pressures.
GP5000S35-0.040-02-0816 BERGQUIST GAP PAD 5000S35(BERGQUIST thermal pad) Typical Applications Include:
• Voltage Regulator Modules (VRMs) and POLs
• CD-ROMs and DVD-ROMs
• PC Board to chassis
• ASICs and DSPs
• Memory packages and modules
• Thermally-enhanced BGAs
Configurations Available:
• Die-cut parts are available in any shape or size, separated or in sheet form
