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    BERGQUIST GP5000S35  Features and Benefits

    • High-thermal conductivity: 5.0 W/m-K

    • Highly conformable, “S-Class” softness

    • Naturally-inherent tack reduces

    interfacial thermal resistance

    • Conforms to demanding contours and

    maintains structural integrity with little

    or no stress applied to fragile

    component leads

    • Fiberglass reinforced for puncture,

    shear and tear resistance

    • Excellent thermal performance at

    low pressures

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BERGQUIST GAP PAD TGP 5000 is a fiberglass-reinforced filler and polymer featuring

 a high thermal conductivity. The material yields extremely soft characteristics while maintaining 

elasticity and conformability. The fiberglass reinforcement provides easy handling and converting,

added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application 

and allows the product to effectively fill air gaps,enhancing the overall thermal performance.The top side has

 reduced tack for ease of handling. BERGQUIST GP5000S35  is ideal for high-performance

applications at low mounting pressures.

BERGQUIST GAP PAD 5000S35  Typical Applications Include:

• Voltage Regulator Modules (VRMs) and POLs

• CD-ROMs and DVD-ROMs

• PC Board to chassis

• ASICs and DSPs

• Memory packages and modules

• Thermally-enhanced BGAs

Configurations Available:

• Die-cut parts are available in any shape or size, separated or in sheet form

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