BERGQUIST  GAP PAD TGP 1500R has the same highly conformable,low-modulus polymer as the standard

BERGQUIST  GAP PAD 1500R The fiberglass reinforcement allows for easymaterial handling and 

enhances puncture,shear and tear resistance. The natural tack on both sides of the material allows for

good compliance to mating surfaces of components, further reducing thermal resistance.

BERGQUIST GP1500R  Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Memory modules / chip scale packages

• Areas where heat needs to be transferred to a frame chassis or other type

of heat spreader

Configurations Available:

• Sheet form, die-cut parts, and roll form (converted or unconverted)