BERGQUIST SIL PAD® sets a benchmark in thermal interface materials. The SIL PAD® family of

materials is thermally conductive and electrically insulating. Available in custom

shapes, sheets, and rolls, SIL PAD® materials come in a variety of thicknesses and are

frequently used in SMT applications such as:

• Interface between thermal vias in a PCB, and a heat sink or casting

• Heat sink interface to many surface mount packages

BOND-PLY and LIQUI-BOND

The BOND-PLY family of materials is thermally conductive and electrically isolating. BONDPLY

is available in a pressure sensitive adhesive or laminating format. BOND-PLY provides

for the mechanical decoupling of bonded materials with mismatched thermal coefficients

of expansion. LIQUI-BOND is a high thermal performance liquid silicone adhesive that

cures to a solid bonding elastomer.

Typical applications include:

• Bonding busbars in a variety of electronic modules and sub-assemblies

• Attaching a metal-based component to a heat sink

• Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages

• Bonding flexible circuits to a rigid heat spreader or thermal plane

• Assembly tapes for BGA heat spreader

• Attaching PCB assemblies to housings