BERGQUIST SIL PAD® sets a benchmark in thermal interface materials. The SIL PAD® family of
materials is thermally conductive and electrically insulating. Available in custom
shapes, sheets, and rolls, SIL PAD® materials come in a variety of thicknesses and are
frequently used in SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages
BOND-PLY and LIQUI-BOND
The BOND-PLY family of materials is thermally conductive and electrically isolating. BONDPLY
is available in a pressure sensitive adhesive or laminating format. BOND-PLY provides
for the mechanical decoupling of bonded materials with mismatched thermal coefficients
of expansion. LIQUI-BOND is a high thermal performance liquid silicone adhesive that
cures to a solid bonding elastomer.
Typical applications include:
• Bonding busbars in a variety of electronic modules and sub-assemblies
• Attaching a metal-based component to a heat sink
• Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages
• Bonding flexible circuits to a rigid heat spreader or thermal plane
• Assembly tapes for BGA heat spreader
• Attaching PCB assemblies to housings